Rome, October 12, 2010 – Telit Wireless Solutions, an internationally leading specialist in machine-to-machine (M2M) technology, is launching the GL865-DUAL, the first Telit GSM/GPRS module with LCC (Leadless Chip Carrier) castellation packaging technology, onto the market in October. Its ultra-small form factor, excellent energy efficiency and low unit price make this module perfect for mobile applications and for high-volume use across all industries. Areas of application include medical monitoring equipment, miniaturized security systems and the tracking of people, animals and objects.
The GL865-DUAL modules with LCC castellation package technology are surface mount package devices, which use metalized pads on the sides of the package. This kind of packaging is ideally suited for uncomplicated and low-cost applications based on Four-Layer PCB (printed circuit board). Moreover, with the option for manual soldering and removal, it can also serve niche applications with a low volume production.
“M2M becomes more and more relevant to all aspects of every day life and business and turns into a mass market. Therefore it is essential to provide clients with an infrastructure that is capable to meet the upcoming requirements”, says Sandro Spanghero, Global Vice President R&D at Telit. “Keeping up this trend and expanding our portfolio with a product that is ideally suited for the mass market as well as for specialized products makes us well prepared for the future.”
BGA packaging for highly integrated applications
For customers with highly integrated and complex applications, Telit offers its broad family of m2m modules with Ball Grid Array (BGA) packaging. This is particularly relevant for the automotive and telematics market. BGA is a packaging with one face covered with balls in a grid pattern and therefore requires in comparison to the LCC castellation packaging smaller space. The BGA is also more efficient in regard of number of inputs and outputs.
“Our core strategy is to offer the whole spectrum of relevant wireless technologies, products and services”, further explains Spanghero. “Therefore it is an important step for our portfolio development to offer now the LCC castellation packaging at the same time as our successful and well-known BGA packaging. LCC and BGA packaging complement each other as they serve different market segments, for which reason this is a great addition to our portfolio.”
GSM/GPRS functionality at low unit price
Size and weight are often limiting factors for the mobile use of electronic components. With its dimensions of just 24.4 x 24.4 x 2.7 millimetres and weight of just 3.5 grams, the GL865-DUAL offers GSM/GPRS functionality from a tiny, compact module. Its low unit price and inexpensive surface mount assembly allow it to be used in low-cost equipment. The GL865-DUAL is an entry-level product aimed at EMEA and APAC markets.
As with all Telit modules, the GL865-DUAL also features premium FOTA management, which enables radio-controlled firmware updates to be carried out. The use of RedBend’s vCurrent® receptors, which have already proven their efficiency in millions of mobile phones, means that product updates can be performed by transferring incremental updates. Built-in features such as the integrated TCP/IP protocol stack, a serial multiplexer and remote AT commands extend the application’s range of functions without incurring any additional costs.